Thermal Interface Materials

MH&W Thermal Interface Materials

With the high packing density of power semiconductors, transistor chips and discrete components, etc., the generated heat has to be conducted away as efficiently as possible. MH&W has solutions for almost every type of heat problem and application by offering films, adhesive tapes, thermal grease, gap fillers and other material forms from a variety of manufacturers.

GO TO MH&W Thermal Website


Leave a Reply