BTECHCORP has invented and patented a process for aligning high density fibers through the thickness of a polymer matrix . . . up to 20 million fibers per square inch.
Unique highly thermally conductive graphite fibers (1900 W/m°K) are used to create a Z-axis bulk thermal conductivity of 750 W/m°K (at 40% fiber volume) . . . twice the thermal conductivity of pure copper.
HM-2 Thermally Conductive Adhesive Film is currently being used or evaluated for a variety of Thermal Interface Material applications, including die attach, LED assembly, heat pipe attachment, heat sink attachment and production dice thermal test equipment. An on-going product improvement program (see PowerPoint presentation) has already demonstrated lower total thermal resistance and this will be incorporated into our production process in the near future. A combination of lower interface resistance and higher bulk conductivity will be needed to reach our HM-2 performance Goal.
HM-2 Application Bonding: See Thermoplastic Film Bonding Page, Section A. All instructions f or NTP/TP-3 also apply to HM-2 since they all use the same thermoplastic resin.
| HM-2 Properties | |
|---|---|
| Z-Axis Thermal Resistance | 0.06°C-cm²/W (100μ thick bond) |
| Z-Axis Electrical Resistance | 0.1-0.2 ohms (1.0 cm², 100μ thick) |
| Coefficient of Thermal Expansion | Z-Axis: 0 ppm/°C, X-Y plane: 45 ppm/°C |
| Young’s Modulus | X-Axis: 75 Ksi (0.45 GPa) Y-Axis: 15 Ksi (0.09 GPa) |
| Ionic Purity | Hydrolyzable Chloride <5 ppm Hydrolyzable Sodium <2ppm |
| Rework Temperature | 205°C |
| HM-2 Processing | |
|---|---|
| Product Form | Film pre-form f or reel supply. 2-10 mils (0.05-0.25mm) thick, +/- 0.1 mil |
| Cure Cycle | 100 psi bond compression (<3 sec) at 190°C (resin temperature) |
| Storage Life | 6 months at 27°C (80°F) |